? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 11/25/13 description littelfuse sg series gdt offers high surge ratings in a miniature package. its designed for surface mounting on pcb with small size 4.5x3.2x2.7mm. low insertion loss is perfectly suited to broadband equipment applications. the capacitance does not vary with voltage, and will not cause operational problems with adsl2+, where capacitance variation across tip and ring is undesirable. these devices are extremely robust and are able to divert a 1000a pulse without destruction. features ? rohs compliant and lead-free ? ghz working frequency ? excellent stability on multiple pulse duty cycle ? excellent response to fast rising transients. ? ultra low insertion loss ? 1-2ka surge capability tested with 8/20s pulse as defned by iec 61000-4-5 ? ultra small devices offered in a variety of mounting lead forms ? non-radioactive ? low capacitance (<1pf) ? voltage ranges 75v to 600v ? ul recognized ? conforms to itu-t k12, iec 1000-4-5 ? square outline applications sg series 2 electrode gdt graphical symbol agency approvals agency agency file number e128662 ? communication equipment ? catv equipment ? test equipment ? data lines ? power supplies ? telecom slic protection ? broadband equipment ? adsl equipment, including adsl2+ ? xdsl equipment ? satellite and catv equipment ? general telecom equipment gas discharge tube (gdt) products sg series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 11/25/13 part number device specifcations (at 25c) life ratings dc breakdown in volts (@100v/s) impulse breakdown in volts (@100v/s) impulse breakdown in volts (@1 kv/sec) insulation resistance capaci- tance (@1mhz) arc voltage (@1a) glow to arc transition current glow voltage nominal ac discharge current (x10 @50hz) nominal impulse discharge current (x10 @8/20s) nominal impulse discharge current (10/1000s 100 cycles) min typ max max min max sg75 52 75 98 500 650 >1g (at 50vdc) <1 pf ~10 v ~1.0 a ~60 v 2 a 2ka 10 a sg90 63 90 117 500 600 sg150 105 150 195 500 600 sg230 172 230 288 650 800 1ka sg300 225 300 375 700 850 ~12 v ~0.5 a ~90 v sg300q 210 300 390 580 650 ~20 v ~0.8 a ~140 v na* sg350 263 350 437 750 900 <0.8 pf ~12 v ~0.5 a ~90 v 2 a sg350q 263 350 437 600 700 ~140 v na* sg400 300 400 500 800 950 ~90 v 2 a sg420 315 420 525 800 1000 <1 pf ~10 v <1.0 a ~60 v 2 a sg420q 315 420 525 650 750 ~20 v ~140 v na* sg450q 370 450 550 680 750 >1g (at 100vdc) ~20 v 1 a sg500q 400 500 600 950 1050 <0.5 pf ~16 v ~0.1 a 2 a SG600Q 450 600 750 110 0 1200 <1 pf ~20 v <0.5 a * specification is not applicable for quick response (sgxxxq) version of product product characteristics materials device tin plated 17.512.5 microns construction ceramic insulator. storage and operational temperature -40 to +90 c electrical characteristics v oltage (v) t ime (ns) 0 20 0 40 0 60 0 80 0 1 000 1 20 0 max dynamic breako ver v oltage hold-o ver v oltage on-state v oltage voltage vs. time characteristic @ 1.0 ghz = 0.01 db @ 1.4ghz = 0.1 db @ 1.8 ghz = 0.53 db @ 2.1 ghz = 0.81 db @ 2.45 ghz= 1 db @ 2.8 ghz = 1.2 db @ 3.1 ghz = 1.5 db @ 3.5 ghz = 2.1 db typical insertion loss gas discharge tube (gdt) products sg series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 11/25/13 refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 5c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 10 C 30 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters - refow soldering (surface mount devices) ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature (t 25oc to peak) ramp-down ramp-up preheat critical zone t l to t p device dimensions 4.5 +/- 0.3 2.7 +/- 0.3 0.5 +/- 0.1 5.2 2.8 3.2 +/- 0.3 recommended soldering pad layout 4 dimensions in millimeters. device marking type code a3a production year code (last digit) production month code type code a sg75 b sg90 c sg150 d sg230 e sg300 f sg300q g sg350 h sg350q i sg400 j sg420 k sg420q l sg450q m sg500q n SG600Q month code a january b february c march d april e may f june g july h august i september j october k november l december gas discharge tube (gdt) products sg series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 11/25/13 tape and reel dimensions (iec 60286-3, dimension in mm) 18.4 max. 12.4 +2/-0 11.9 min. ?100 min. ?300 max. 20.2 min. 12.8 min. 1.5 min. r0.75 smd-tape has to withstand a minimum force of f > 20 n / pocket 2 kg / pocket minimum vertical load (minimum checking quantity:10 pockets) a a b b reel speci?cations iec 60286-3 dimensions in mm tape speci?cations iec 60286-3 dimensions in mm section b-b section a-a 2 0.1 12 0 + 0.3 1.75 0.1 4 0.10 ? 1.55 0.05 5.5 0.1 ? 1. 6 0.1 8 0.1 3.65 0.1 r0.5 typical 4.9 0.1 5 3 0.1 0.4 0.05 5 part numbering system and ordering information sg xxx q breakdown v oltage 75 = 75v 90 = 90v 150 = 150v 230 = 230v 300 = 300v 350 = 350v 400 = 400v 420 = 420v 450 = 450v 500 = 500v 600 = 600v series square gdt device option code (blank) = standard device q = quick response version (300v, 350v, 420v, 450v, 500v, 600v only) packaging part number and device type quantity and packaging description sgxxx surface mount 2000pcs/reel in tape and reel gas discharge tube (gdt) products sg series
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